This product complies with the RoHS Directive (EU 2002/95/EC).
Transistors
2SC3757
Silicon NPN epitaxial planar type
For high-speed switching
Unit: mm
+0.10
–0.05
0.40
3
+0.10
–0.06
0.16
■ Features
• Low collector-emitter saturation voltage VCE(sat)
• Mini type package, allowing downsizing of the equipment and au-
tomatic insertion through the tape packing and the magazine
packing
1
2
(0.95) (0.95)
1.9 0.1
+0.20
2.90
–0.05
■ Absolute Maximum Ratings Ta = 25°C
10˚
Parameter
Collector-base voltage (Emitter open) VCBO
Collector-emitter voltage (E-B short) VCES
Emitter-base voltage (Collector open) VEBO
Symbol
Rating
Unit
V
40
1: Base
2: Emitter
3: Collector
40
V
5
100
V
EIAJ: SC-59
Mini3-G1 Package
Collector current
IC
ICP
PC
Tj
mA
mA
mW
°C
Peak collector current
Collector power dissipation
Junction temperature
Storage temperature
300
Marking Symbol: 2Y
200
150
Tstg
−55 to +150
°C
■ Electrical Characteristics Ta = 25°C 3°C
Parameter
Symbol
ICBO
Conditions
Min
Typ
Max
0.1
Unit
µA
µA
Collector-base cutoff current (Emitter open)
Emitter-base cutoff current (Collector open)
Forward current transfer ratio *
Collector-emitter saturation voltage
Base-emitter saturation voltage
Transition frequency
VCB = 15 V, IE = 0
IEBO
VEB = 4 V, IC = 0
0.1
hFE
VCE = 1 V, IC = 10 mA
60
200
0.25
1.0
VCE(sat) IC = 10 mA, IB = 1 mA
0.17
V
VBE(sat) IC = 10 mA, IB = 1 mA
V
fT
VCB = 10 V, IE = −10 mA, f = 200 MHz
450
2
MHz
pF
Collector output capacitance
Cob
VCB = 10 V, IE = 0, f = 1 MHz
6
(Common base, input open circuited)
Turn-on time
Turn-off time
Storage time
ton
toff
tstg
17
17
10
ns
ns
ns
Refer to the switching time measurement
circuit
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. : Rank classification
*
Rank
Q
R
hFE
60 to 120
90 to 200
Publication date: February 2004
SJC00136CED
1
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
|